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SAL Science & Stories No. 10 / May 2020
Content
  1. SAL-DC: Talent factory for top researchers of tomorrow
  2. You want to become a future research leader? Apply now and learn from renowned experts.
  3. PhD Topics: From mmWave to Machine Learning and Artificial Intelligence
  4. New quantum lab for SAL Villach
  5. Project call for cooperative research: Wireless Security & Safety Classifier Environment
  6. SAL aims to reduce aerial noise emissions
  7. Paper: Thermosonic direct Cu pillar bonding for 3D die stacking

A message from Gerald Murauer, Executive Director of SAL

We at SAL have very ambitious goals for the development and growth of our organization. We want Silicon Austria Labs to become a top research center for Electronic Based Systems and strengthen the EBS ecosystem significantly. To do so we need top researchers with innovative ideas and the drive to make the world a better place, e.g. via technology solutions for lower energy consumption. The SAL Doctoral College is a great opportunity for the next generation of researchers to leave their footprint and be part of a growing organization. We are looking forward to meeting enthusiastic researchers who want to start their success story with us and help us bring SAL to the next level.

SAL-DC: Talent factory for top researchers of tomorrow
SAL has been founded with the aim to become a top Euro­pean re­search center for Elec­tronic Based Systems (EBS). In order to pursue cutting edge re­search for EBS and to cope with the arising chal­lenges in this field, SAL requires well-trained experts from multiple disci­plines of science, engi­nee­ring and tech­no­logy. Toge­ther with TU Graz, JKU Linz and University of Klagen­furt, SAL founded the SAL Doctoral College (SAL-DC).

The SAL-DC is a novel doctoral training program for researchers focusing on the field of EBS. SAL cooperates with industry, academic and scientific partners on a regional, national and international level with the aim to build an excellent research network and ecosystem for EBS. Fellows benefit from the training in a highly international, interdisciplinary and intersectoral setting offered by SAL-DC to become future research leaders.


You want to become a future research leader? Apply now and learn from renowned experts. 
The SAL Doctoral College was created for YOU. We are looking for enthusiastic researchers who want to creative innovative technologies for the Electronic Based Systems of the future. You can work in an interdisciplinary, international team and learn from renowned experts in their respective fields. 

Our steering comittee consists of Hans-Peter Bernhard, Marcel Baunach (TU Graz), Alois Zoitl (JKU Linz) and Bernhard Rinner (University of Klagenfurt). Hans-Peter Bernhard works in wireless factory communications and signal processing. He is supervising the SAL-DC. Marcel Baunach is conducting research on highly dependable embedded systems for future vehicles, Internet of Things, cyberphysical systems, and more. Bernhard Rinner is working on sensor networks, multirobot systems, self-organization and pervasive computing. Alois Zoitl is conducting research on flexible adaptive production systems, highly distributed control and software engineering methos for cyberphysical engineering and production systems.

Our supervisors have a broad range of expertise, which they will share with our future PhD students. Bernhard Aichernig is an expert in formal methods and testing. His re­search covers a variety of areas combi­ning falsi­fi­ca­tion, veri­fi­ca­tion and abstrac­tion tech­ni­ques. Bernd Deutschmann's re­search inte­rests include EMC design for inte­grated circuits, power elec­tro­nics, and EMC simu­la­tion and measu­re­ment tech­ni­ques. Jasmin Grosinger is conducting research in the area of Ultra-Low Power Micro­wave Compo­n­ents and Systems. Sepp Hochreiter's research focus is on Arti­fi­cial Intel­li­gence, Machine Learning, Deep Learning, Long Short-Term Memory, Rein­force­ment Learning, Vision, Repre­sen­ta­tional Learning, Natural Language Process­ing (NLP), and Bioin­for­matics. Mario Huemer focuses on the algo­rithmic-, archi­tec­tural- and hard­ware-oriented aspects of signal process­ing systems. Manfred Kaltenbacher is conducting research on numer­ical simu­la­tion and opti­miza­tion as well as model order reduc­tion tech­niques for multi-phys­ical fields using the Finite Element Method. Annette Mütze focuses on increasing the reli­a­bility, effi­ciency, and utiliza­tion of vari­able speed drive systems by addressing the inter­ac­tion between the different compo­nents of the system. Thomas Pock is conducting research on image process­ing, computer vision, inverse prob­lems, convex and non-smooth opti­miza­tion, and machine learning. Harald Pretl focuses on RFIC imple­men­ta­tions, touching analog as well and mixed-signal aspects. Andreas Springer works on wire­less sensor networks for indus­trial appli­ca­tions in which aspects like real-time, reli­a­bility, secu­rity, safety and local­iza­tion of sensor nodes are impor­tant. Andreas Stelzer is focusing on, amongst others, microwave sensor systems for indus­trial and auto­mo­tive appli­ca­tions and inte­grated radar sensor concepts. Robert Wille works on the design of circuits and systems for both conven­tional and emerging tech­nolo­gies.


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PhD Topics: From mmWave to Machine Learning and Artificial Intelligence
13 institutes from the three partner universities are participating in the SAL-DC, amongst others, the Institute of Electronics (TU Graz), the Institute for Machine Learning (JKU Linz) and the Institute of Networked and Embedded Systems (University of Klagenfurt). The topics range from mmWave sensing to machine learning, artificial intelligence, embedded networks, and many more.

Pursue cutting-edge research on the following topics
• ML Approaches for Wireless Communications Engineering
• AI for Industrial SoC Design
• High-Performance Building Blocks for mm-Wave Transceivers in Communications and Radar
• Next Generation mm-Wave Sensing
• Automata Learning and Automated Testing
• Embedded Variational Networks
• Full-Duplex High-Speed Serial Links
• Industrial Wireless Sensor Networks
• Wireless Communication for Critical Control in the Factory of the Future

Apply to the SAL-DC


New quantum lab for SAL Villach
SAL Villach currently establishes a new laboratory devoted to femtosecond time-resolved and non-linear spectroscopies.The related construction works will be finished by mid of June. The new lab will accommodate two optical tables and provide stable thermal and humidity conditions. Its heart will be a newly acquired scientific laser system (tender process ongoing) capable of providing intense femtosecond laser pulses, wavelength tune-able across the full spectral range from the ultraviolet to the mid infrared.

This infrastructure enables the implementation, test and verification of novel ultrafast spectroscopic methods at SAL. The short laser-pulse durations and correspondingly high peak intensities allow to probe solid state and molecular systems on their natural time-scales and enable the preparation and exploitation of coherent superposition states, delivering a wealth of information not accessible with linear spectroscopies. Applications of such techniques span from novel diagnostic methods for solid state systems (e.g. relevant for semiconductor industries) to chemical analytics and bio-chemical investigations.

Beyond spectroscopies, the coherently controlled excitation of quasiparticles (e.g. excitons, polarons, phonons etc.) in solids or molecular systems, as facilitated by such short laser pulses, may enable novel opto-electronic (quantum-) devices- and sensing schemes in the future.

Project call for cooperative research: Wireless Security & Safety Classifier Environment

Project objectives: This project explores concepts to develop a testing frame­work that is capable to iden­tify, Verify and Vali­date (V&V) system under test of in-vehicle wire­less compo­nents in order to facil­i­tate cyber-secu­rity testing.

Partner call open until: June 15th, 2020

Start of the project: Q2 2020

Contact: contact@silicon-austria.com

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SAL aims to reduce aerial noise emissions
The contribution of the aviation sector to the global CO2 emissions was 2,8% in 2019, and air traffic is a major source of noise in urban areas close to airports. The Clean Sky 2 program targets to reduce the CO2 and noise emissions in the year 2030 by approximately 30% in different aviation concepts. After the COVID-19 crisis, a quick recovery of the aviation sector is anticipated, and emission-neutral fuels are not expected to become profitable in the next years. Thus, the goal in reduction of emissions and noise can only be achieved by innovations in aerodynamic design and propulsion systems.

With the new H2020 project AEROMIC, 6 partners from 4 European countries, including SAL (coordinator of the proposal), aim to develop new digital Microphone-MEMS-Sensors for wind tunnels with open/closed test sections and flight tests. The partners stem from Austria, Germany, Spain and Norway, giving the project a truly European dimension. The AEROMIC consortium is composed of 2 SMEs, 3 university research groups, and one research institute. SAL aims to focus on developing a new piezoelectric MEMS microphone and a digital microphone array based on the MEMS microphone, which is dedicated to accurate acoustic measurements with high spatial resolution during wind-tunnel and flight tests and suitable for surface unsteady pressure measurements at arbitrary model/aircraft position (including cockpit area).

The outcome of the project will mainly contribute to the conceptual aircraft or air transport types including Advanced Long-range, Ultra-advanced Long-range, Advanced Short/Medium-range, and Ultra-advanced Short/Medium-range. The expected impacts related to the program's high-level objectives are reducing noise emissions and improving EU competitiveness.

Paper: Thermosonic direct Cu pillar bonding for 3D die stacking
Ali Roshangias, senior scientist in the research unit Heterogeneous Integration Technologies, co-wrote a paper on "Thermosonic direct Cu pillar bonding for 3D die stacking", which was published on Springer Link.

Abstract: The emerging 3D IC stacking technology as one of the main platforms for 3D integration gains significant performance advantages by using copper (Cu) pillar interconnections. Although thermocompression Cu bonding offers reliable interconnections with demonstrated bond stability at high temperatures, it requires high pressures, high temperatures and long process time. As an alternative to thermocompression bonding, thermosonic flip-chip bonding of Cu-pillared silicon chips is studied here. In this study, thermosonic bonding parameters (i.e., ultrasonic energy, bonding temperature and pressure) were optimized for Cu-pillared chips. The bonded samples were further characterized by die shear strength analysis and interfacial microscopy.

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