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SAL Science & Stories No. 11 / June 2020
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A message from Gerald Murauer, Executive Director of SAL
With this newsletter, we want to present our diversity as a very positive aspect of SAL. We have an international, interdisciplinary team as you can see in this month’s topics. We started working on the project InSecTT, which brings together industrial players, SMEs, research centers and universities to work on “Artificial Intelligence of Things”. Our EMCC group published a new paper and we currently have open project calls in different fields of research. It’s good to see that through COVID-19, we managed to continue with our projects and start new endeavors, such as our SAL Doctoral College. We are more and more successful in bringing international talents to Austria – we will focus on that “Brain Gain” in the next newsletter.
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SAL-DC: Talent factory for top researchers of tomorrow
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You want to shape the future of Electronic Based Systems with your innovative ideas? Then apply now to the SAL Doctoral College (SAL-DC) and become part of our team.
The SAL-DC is a novel doctoral training program for researchers focusing on the field of EBS. SAL cooperates with industry, academic and scientific partners on a regional, national and international level with the aim to build an excellent research network and ecosystem for EBS. Fellows benefit from the training in a highly international, interdisciplinary and intersectoral setting offered by SAL-DC to become future research leaders.
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Project InSecTT provides secure & intelligent systems for industrial applications
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Together with 51 partners, SAL started working on the project InSecTT, which is coordinated by VIRTUAL VEHICLE from Austria. Funded under the umbrella of the ECSEL Joint Undertaking, more than 45 million Euro will be spent during the next three years on bringing the Internet of Things and Artificial Intelligence together in order to achieve the full potential of the “Artificial Intelligence of Things".
Artificial Intelligence of Things (AIoT) is the natural evolution for both Artificial Intelligence (AI) and Internet of Things (IoT) because they are mutually beneficial. AI increases the value of the IoT through machine learning by transforming the data into useful information, while the IoT increases the value of AI through connectivity and data exchange. Therefore, InSecTT – Intelligent Secure Trustable Things, a pan-European effort with 52 key partners from 12 countries (EU and Turkey), will provide intelligent, secure and trustworthy systems for industrial applications to provide comprehensive cost-efficient solutions of intelligent, end-to-end secure, trustworthy connectivity and interoperability to bring the Internet of Things and Artificial Intelligence together. InSecTT aims at creating trust in AI-based intelligent systems and solutions as a major part of the AIoT.
InSecTT will foster cooperation between big industrial players from various domains, a number of highly innovative SMEs distributed all over Europa and cutting-edge research organisations and university. The project will also open up new market opportunities for the European industry, will significantly reduce time to market and decrease costs for trustable AIoT solutions on the market, in particular by using new designs and technical building blocks.
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Paper: 3D model of a commercial 9V alkaline battery for EMC simulation
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Herbert Hackl, Martin Ibel and Bernhard Auinger, researchers in the EMCC unit at SAL, co-wrote a paper on "3D model of a commercial 9V alkaline battery for EMC simulation".
The emerging 3D IC stacking technology as one of the main platforms for 3D integration gains significant performance advantages by using copper (Cu) pillar interconnections. Although thermocompression Cu bonding offers reliable interconnections with demonstrated bond stability at high temperatures, it requires high pressures, high temperatures and long process time. As an alternative to thermocompression bonding, thermosonic flip-chip bonding of Cu-pillared silicon chips is studied here. In this study, thermosonic bonding parameters (i.e., ultrasonic energy, bonding temperature and pressure) were optimized for Cu-pillared chips. The bonded samples were further characterized by die shear strength analysis and interfacial microscopy.
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Project call for cooperative research: Pre-estimation of radiated electromagnetic interference (EMI) of Electronic Based Systems
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Electromagnetic compatibility testing is often neglected in the development cycles of Electronic Based Systems of the future and is subsequently carried out at high costs after the prototype has been manufactured. The SAL project PREMI - Pre-estimation of radiated electromagnetic interference (EMI) of Electronic Based Systems - can be a solution to this challenge. We will revolutionize existing methods in modeling, simulation and measurement. This gives our partners the possibility to accelerate the development of new technologies and face future challenges.
Partner call open
Start of the project: Q3 2020
Contact: contact@silicon-austria.com
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Project call for cooperative research: Piezo MEMS Micro-Mirror for Emerging Applications
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In this project, we will study emerging applications for autonomous vehicles, such as Smart Road Lighting Based on Distance Measurements and LIDAR systems. The aim of the project is to provide next generation of vehicle lighting systems, integrating enhanced interaction with the environment.
Partner call open
Start of the project: September 2020
Contact: contact@silicon-austria.com
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International SAL employees successfully finish German class
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SAL is proud to have an international, interdisciplinary and diverse team. Different languages and cultures come together and foster innovative ideas. In order to help our international employees integrate themselves into the Austrian culture, some of our researchers from Linz now successfully finished their first German class. Herzlichen Glückwunsch!
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